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Vapor Chambers are designed for vastly improved thermal performance over traditional solid metal heat spreaders found in traditional CPU coolers. This is accomplished while achieving a reduced weight and height. Vapor Chamber technology enables higher CPUs with a higher TDP (or overclocked state) to be efficiently and effectively cooled to safe operating temperatures, extending component and product life.


Vapor Chambers are filled with coolant that, when heated, change phases from a liquid to a gas and back again. The vaporized coolant circulates via convection and moves freely through the chamber. The molecules then condense on cold surfaces, dissipate their heat load, and are channeled back to the coolant reservoir. The system is able to absorb and dissipate large amounts of heat through this method. Condensation varies based on the change in temperature between the coolant and the contact surface. The chamber is setup in a way that the coolant will automatically stream towards the coolest surface area. This self-organization of the coolant molecules within the Vapor Chamber is responsible for its superior thermal properties. As a result it provides stable and evenly spread temperatures on all of its surfaces, regardless of the location and density of the heat source below the chamber base. This makes the vapor chamber capable of dissipating large wattage heat sources from high-end and overclocked processors.


Horizontal Vapor Chambers (HVC) refers to the orientation of the vapor chamber system. They function exactly as described above. The majority of their surface area is laid flat against the heat source, or CPU in this case. HVC technology is more commonly found cooling the immense heat load produced by the graphics card in your system. More recently, Cooler Master has integrated this highly effective technology into its V8 GTS CPU cooler. It marries this HVC technology with the proven effectiveness of our heat pipe based tower cooling. The illustration below shows the difference between a traditional heat pipe based tower cooler and one that has integrated HVC technology.


In the market for a new cooler, but not sure which way to go? If watercooling is not something you are ready to consider then the TPC 812, TPC 612, and V8 GTS all offer high performance air cooling via their HVC and VVC technology. These vapor chamber coolers offer cooling that meets or exceeds the cooling of many All-In-One (AIO) CPU watercoolers. TPC 812, TPC 612 and V8 GTS also operate without the maintenance and/or replacement that many AIO CPU watercoolers will eventually need.

The decision is made easy by the solid designs that make up the TPC 812, TPC 612 and V8 GTS. These VVC and HVC coolers were engineered to provide enthusiast level performance. Each is constructed using Vapor Chambers in a different orientation, but they both cool extremely well on higher end hardware. Users on a budget can still get great performance out of the more traditionally designed TPC 812 tower CPU cooler. Users looking for a CPU cooler with an aggressive outlook to match their system build will find the V8 GTS to be a great selection. Either way, both coolers will provide the same excellent performance with their integrated Vapor Chamber and heatsink technology.

  • Engine Design
  • Horizontal Vapor Chamber (HVC)
  • Triple Tower Heatsink with 8 High Performance Heatpipes
  • POM Bearing & Red LED Fans

TPC 812
  • First CPU Cooler to utilize Vertical Vapor Chamber (VVC)
  • Dual technologies: 2 Vapor Chambers, 6 Heat Pipes
  • 100% Pure Polished Copper Base
  • Designed for Overclocked CPUs

TPC 612
  • Vertical Vapor Chamber (VVC)
  • Dual technologies: 2 Vapor Chambers, 4 Heat Pipes
  • 100% Pure Polished Copper Base
  • Designed for Superior Air Cooling


The transfer of heat from one place to another by the movement of fluids.

Thermal Design Power; refers to maximum amount of power the cooling system in a computer is required to dissipate.